Samsung Electronics saw its stock price jump by more than 6% this week following the announcement that the company has begun shipping samples of its next-generation HBM4E high-bandwidth memory chips to global customers. This development marks a significant milestone in the company’s efforts to capture a larger share of the rapidly expanding artificial intelligence hardware market.

The new 12-layer HBM4E chip is being touted as an industry-first, capable of reaching speeds up to 16 Gigabits-per-second while offering superior thermal management and energy efficiency. By stacking Dynamic Random-Access Memory vertically, the unit provides a 48-gigabyte capacity, which represents a 30% increase over previous iterations. Samsung has indicated that it intends to diversify this lineup further, with plans for 8-layer 32GB and 16-layer 64GB configurations to meet specific client demands.

High-bandwidth memory is a critical component for modern AI infrastructure, enabling processors to manage the massive data loads required by advanced accelerators like Nvidia’s Rubin and Google’s Ironwood Tensor Processing Units. As the race to dominate the AI memory sector intensifies, Samsung is working to close the competitive gap with rivals such as SK Hynix and Micron. This latest product rollout follows the company’s initial HBM4 shipments earlier this year, signaling a strategic push to solidify its role as a primary supplier for the next generation of global AI technology.